Thermal Conductivity Measurements of Conductive Epoxy Adhesives by MDSC~R

摘要

Determination of a material's thermal conductivity is important in evaluating its utilityrnfor a specific application. A variety of techniques are available to determine thermalrnconductivity, among them being Modulated DSC~?. MDSC~? has the advantage for measuringrnthermal conductivity of being readily available due to its application to the study of glassrntransition, melting temperature, crystallization, etc. of materials. In this study it is shown that thernrange of MDSC for thermal conductivity measurements is extended up to 4.0 W/(K m) for thernuse with conductive epoxy based adhesives.