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3-D measurement method based on Wavelet transform by using SEM

机译:基于小波变换的SEM 3-D测量方法

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Three-dimensional measurement of micro-size products is performed by optical methods and/or SPM-technology. However, there are some problems in each method. In this paper, a novel three-dimensional measurement method for a micro size product is proposed by using the Wavelet transform and the electron-beam of SEM. To perform the measurement, the mechanism of producing shadows of the grid on the surface of the object by back scattering electron beam is discussed. The principle of measurement by using this phenomenon of shadows of grid is proposed. In experiment, a bearing ball whose diameter is 500μm is measured by a grating made of a silicon wafer. It can be confirmed that the standard deviation of this measurement is about 400nm.
机译:微型产品的三维测量是通过光学方法和/或SPM技术进行的。但是,每种方法都存在一些问题。本文提出了一种新的三维尺寸测量方法,利用小波变换和扫描电镜的电子束。为了进行测量,讨论了通过反向散射电子束在物体表面产生栅格阴影的机理。提出了利用这种阴影现象进行测量的原理。在实验中,用硅晶片制成的光栅测量直径为500μm的轴承球。可以确认该测量的标准偏差为约400nm。

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