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Test coverage models for system test?

机译:测试系统测试的覆盖型号?

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In the world of IC testing, efficiency measurements are based on test coverage of modeled faults, often stuck at faults. While this has been effective at the chip level to improve the quality of chip testing, the question is how can this be transferred to the system test level? At the system level we are faced with several potential complications in measuring the quality of the test process. These include the fact that all of the chips have already been tested individually and tested again when they were put on the board. This previous testing leads to a vague fault spectrum and a non-random fault distribution. Do we count the supplier test coverage in the overall system test coverage? Multiple suppliers with different levels of test coverage and quality for the same component can also complicate the determination of test coverage. System configuration options can vary widely within one system type. These complexities need to be dealt with while keeping any test coverage analysis simple enough to explain to management and other stakeholders. The author will discuss two possible techniques to address these complications. In the first technique, we will look at what a comprehensive fault model may look like at the system level. The second technique involves a more traditional approach of implementing a test coverage analysis based on functional faults and Failure Mode Effect Analysis (FMEA).
机译:在IC测试的世界中,效率测量基于模型故障的测试覆盖范围,经常陷入故障。虽然这一直有效地在芯片层面提高芯片测试的质量,但问题是如何将其转移到系统测试水平?在系统级别,我们面临着测量测试过程质量的几个潜在的并发症。这些包括所有芯片已经在被单独测试并在将它们放在董事会时再次进行测试。此前测试导致模糊的故障频谱和非随机故障分布。我们是否在整体系统测试覆盖范围内计算供应商测试覆盖范围?具有不同水平的测试覆盖率和相同组件质量的多种供应商也可以使测试覆盖范围的测定复杂化。系统配置选项可以在一个系统类型中差异很大。这些复杂性需要处理,同时保持任何测试覆盖分析,足以向管理和其他利益相关者解释。作者将讨论两种可能的技术来解决这些并发症。在第一种技术中,我们将看看系统级别的全面故障模型可能看起来像什么。第二种技术涉及一种基于功能故障和故障模式效应分析(FMEA)的测试覆盖分析的更传统的方法。

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