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The Effect of Cathode Surface Treatment on the Properties of Electrodeposited Copper Powders

机译:阴极表面处理对电沉积铜粉末性能的影响

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The main attention is paid to the study of processing mechanisms the surface of the electrode affects the kinetics of the electrodeposition of metals from various solutions of their complex salts, as well as improving the technology of obtaining electrolytic powder. Special attention was paid to the detailed study of regularities of the processes occurring during the electrodeposition of copper. Discussed features of the processes of separation of copper powders from solutions of ammonium chloride with addition of complexing polymers of polyacrylamide and polyvinylpyrrolidone's. The basic laws of surface treatment are considered cathode and processes affecting the kinetics of electrodeposition of metals various factors on the particle growth rate and purity of the resulting powders. Researches on improvement of technology of receiving and the intensification of the processes of electrodeposition of copper powders from complex electrolytes'.
机译:对处理机制的研究进行了主要关注,电极表面影响金属电沉积的电沉积来自其复合物盐的各种溶液的动力学,以及改善获得电解粉的技术。 特别注意在铜电沉积期间发生的过程的规律性详细研究。 添加了聚丙烯酰胺和聚乙烯吡咯烷酮络合聚合物的氯化铵溶液中铜粉末分离过程的特征。 表面处理的基本定律是阴极和影响金属电沉积动力学的阴极和方法各种因素对所得粉末的颗粒生长速率和纯度。 复杂电解质铜粉电沉积电沉积工艺技术改进的研究。

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