首页> 外文会议>Pacific Rim Meeting on Electrochemical and Solid-State Science >Epitaxy of Pseudomorphic GeSn Layers with Germane (GeH_4) or Digermane (Ge_2H_6) as Ge Precursors and Tin Tetrachloride (SnCl_4) as the Sn Precursor
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Epitaxy of Pseudomorphic GeSn Layers with Germane (GeH_4) or Digermane (Ge_2H_6) as Ge Precursors and Tin Tetrachloride (SnCl_4) as the Sn Precursor

机译:用锗烷(Geh_4)或Digermane(Ge_2H_6)作为Ge前体和四氯化锡(SnCl_4)作为Sn前体的纯度晶体Gesn层外延

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In CEA-LETI, GeSn/SiGeSn stacks are typically grown at 100 Torr with Ge_2H_6, Si_2H_6 and SnCl_4 and temperatures in the 301°C-363°C range. Ge_2H_6 has however a reputation of being unstable for high concentrations (10% in H_2). The short shelf time can be adressed by switching over to lower concentrations and regularly changing bottles, which is complex as Ge_2H_6 is costly and complicated to order. One solution could be to switch from digermane to germane, which was shown by several R&D institutes to yield high quality GeSn layers. The epitaxy tools used, then, were capable of Atmospheric Pressure CVD (i. e. @ 760 Torr), while we have Reduced Pressure CVD chambers that can operate only up to a few hundreds of Torr.
机译:在CEA-Leti中,GESN / SIGESN堆叠通常在100托的GE_2H_6,SI_2H_6和SNCL_4和301°C-363°C范围内的温度生长。 然而,GE_2H_6的声誉对于高浓度不稳定(在H_2中10%)。 通过切换到较低浓度和定期更换的瓶子可以通过切换到较大的瓶子,随着GE_2H_6成本高昂的速度和顺序复杂。 一种解决方案可以是从DIGMANE切换到GEDANE,其由几个研发机构示出,以产生高质量的GESN层。 然后,使用的外延工具能够进行大气压CVD(即@ 760 Torr),而我们减少了压力CVD腔室,只能运行到几百个Torr。

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