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POROSITY TEST OF GOLD PLATING CONTACTS AND EVALUATION TEST OF CONNECTORS

机译:镀金触点的孔隙率测试和连接器的评估试验

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In connection with the deterioration of contacts In connectors, the corrosion caused by the pores is considered as one of the primary factors. In order to make this relation clear, the authors studied the relationship between the pores and thickness of gold plating. Further, the authors studied the contact resistance in the relationships with the pores and with the mechanical wear of the gold plating due to sliding by means of the corrosion test. The detection of the pores was made in the corrosive atmosphere of ammonium polysulfide. This atmosphere blackens nickel and copper in a short time with ease. And further the difference between nickel and copper can be shown by immersing them into sulfuric acid solution. Furthermore, corrosion tests have been carried out in various kinds of atmospheres. The test of this time was made in an atmosphere of gaseous mixture of H_2S + NO_2. Of the evaluation test s of connectors, the compound test, which combines the mechanical wear test and the corrosion test is most recommended.
机译:结合连接器中触点的劣化,由孔引起的腐蚀被认为是主要因素之一。为了使这一关系清晰,作者研究了镀金孔隙与镀金厚度之间的关系。此外,作者研究了与孔关系中的接触电阻,并且由于耐腐蚀试验滑动而导致的金电镀的机械磨损。在多硫化铵的腐蚀气氛中制备孔的检测。这种氛围在短时间内将镍和铜变黑。并且可以通过将它们浸入硫酸溶液中来示出镍和铜之间的差异。此外,腐蚀试验已经在各种环境中进行。在H_2S + NO_2的气态混合物的气氛中进行了对该时间的测试。在连接器的评价测试中,最结合机械磨损试验和腐蚀试验的复合试验是最推荐的。

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