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Effects of Antibacterial Treatment Temperature on the Properties of Copper-Bearing Antibacterial Duplex Stainless Steels

机译:抗菌治疗温度对铜耐抗菌双相不锈钢性能的影响

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Antibacterial copper-rich phases such as s-Cu were precipitated in copper-bearing antibacterial duplex stainless steels after antibacterial treatment. In this paper, the effects of antibacterial treatment on the corrosion resistance properties of copper-bearing antibacterial duplex stainless steels were investigated by electrochemical methods. The film-cover method was used to antibacterial tests.The results showed that as the antibacterial treatment temperature increased in the rang of 540-580 °C, the copper -rich precipitates grew faster and evolved from granular into rod-like. With the proportion of rod-like copper-rich phases in matrix increased, the resistant to pitting corrosion decreased and the positions of copper-rich phase precipitated were apt to become pitting nucleation source.The presence of s-Cu and other copper-rich phases in passive film reduced the overall potential and passive film resistance, decreasing the stability of passive film. Antibacterial test showed that with the treatment temperature increased, the volume fraction and the uniformity of the distribution of copper-rich precipitates in the matrix first increased, then decreased, resulting in the changes in antibacterial properties of the steels, and 560 °C obtained the best antibacterial effect.
机译:在抗菌治疗后,在铜抗菌双相不锈钢中沉淀出富含抗菌铜的相。本文通过电化学方法研究了抗菌处理对耐铜抗菌双相不锈钢耐腐蚀性的影响。薄膜覆盖方法用于抗菌试验。结果表明,随着抗菌处理温度在540-580℃的RANG增加,铜 - 中间沉淀物增长更快并从粒状进化到棒状。随着基质中的耐棒状富铜相的比例增加,对蚀腐蚀的抗性降低,富含富含铜的相位沉淀的位置易于变形成核来源。S-Cu和其他富含铜相的存在在无源膜中降低了整体电位和无源膜阻力,降低了无源膜的稳定性。抗菌试验表明,随着治疗温度的增加,体积分数和富含铜沉淀物分布的均匀性首先增加,然后降低,导致钢的抗菌性能的变化,560℃得到560℃最佳抗菌效果。

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