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Variable Frequency Microwave Curing of SU8 Photoresist Films

机译:SU8光致抗蚀剂薄膜的可变频率微波固化

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Photoresist used in the fabrication of Microelectrochemical Systems (MEMS) has traditionally been processed using conventional curing technology. This type of curing is often time intensive and results in non-uniform products. A uniform bake of the layer is not always possible due to the mechanisms of heat transfer conventional curing offers, leading to poor pattern resolution, formation of micro-cracks and severe outgassing occurring as a consequence. The Variable Frequency Microwave (VFM) Technique was successfully utilised in this study as an alternative method for the processing of negative tone SU8 photoresist. The VFM method was compared to the conventional processing method, which utilises a Hotplate, and a hybrid method utilizing both Hotplate and the VFM and found that an increase on the degree of cure was observed using the VFM at similar processing temperatures which means that SU8 curing at lower temperatures or rapid curing is possible. The increase in cure rates can be attributed to a combination of heat transfer and the unique capability of microwave to couple with the sample. Optical studies of the microstructures fabricated suggest that films that have a degree of cure of <60% resulted in poor quality microstructures. The VFM was found to achieve satisfactory microstructures at most of the temperatures tested as compared to the other two methods tested.
机译:在传统上使用传统的固化技术处理了用于制造微电色​​化学系统(MEMS)的光致抗蚀剂。这种类型的固化通常是时间密集的,并导致非均匀的产品。由于传热常规固化的机制,导致图案分辨率不良,因此,由于传热传统固化的机制,因此,由于图案分辨率差,形成了微裂纹和严重放气而导致的均匀烘烤。该研究成功地利用了可变频率微波(VFM)技术作为处理阴性SU8光致抗蚀剂的替代方法。将VFM方法与使用热板的常规加工方法进行比较,以及利用热板和VFM的混合方法,发现使用VFM在类似的加工温度下观察到固化程度的增加,这意味着SU8固化在较低的温度下或快速固化是可能的。固化率的增加可归因于传热和微波与样品耦合的独特能力的组合。制造微结构的光学研究表明,具有<60%的膜的薄膜导致质量差的微观结构。发现VFM在与测试的其他两种方法相比测试的大多数温度下实现令人满意的微观结构。

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