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Study on Resistivity Changes of Local Material Silicon Wafer Doped with Neutron Transmutation Doping (NTD) Using Multi Purpose Nuclear Reactor (MPR-30)

机译:使用多用途核反应堆(MPR-30)用中子嬗变掺杂(NTD)掺杂局部材料硅晶片电阻率变化的研究(MPR-30)

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Study on resistivity changes of local material silicon wafer, doped with Neutron Transmutation Doping (NTD) using Multi Purpose Nuclear Reactor (MPR-30) was carried out. Two kinds of local material of intrinsic silicon wafer were used as samples for this experiment. These local silicon wafers have no shallow doping. The first have resistivity of between (0.7960 –0.8010) Ω cm (sample 1). The second have resistivity of between (18.6000 – 33.0000) Ω cm (sample 2). The samples were cleaned with distilled water, and acetone. The samples were sprayed with high pure nitrogen gas. The natural oxide layer on the surface of the local silicon wafer was etched with HF for 1 until 3 minutes. The local silicon wafer was inserted into the aluminum tube. The diameter of aluminum tube was 7 inch. High of aluminum tube was 40 cm. The position of the sample 1 was in the aluminum tube 4 cm that was lower than in the sample 2. The local silicon wafers were irradiated with thermal neutron, in Neutron Transmutation Doping (NDT) facility, in research nuclear reactor MPR-30 (Multi Purpose Reactor-30), Indonesia. The power reactor for the experiment was 15 Mega Watt (MW). The thermal neutron flux was 10~(12) neutron cm~(-2) s~(-1). The irradiation time was 264 hours. After irradiated samples, the local silicon wafers were annealed at a temperature of 700°C, for one hour. The resistivity of local silicon wafers before and after irradiated, measured by four-point probe. The results showed that average resistivity of sample 1 before the irradiated was 0.8120 Ω cm, and after irradiation its resistivity decreased to 0.0673 Ωcm. The average resistivity of sample 2 before the irradiated was 20.4890 Ω cm, and after irradiation its resistivity decreased to 0.9730 Ω cm. The resistivity of sample 1 and sample 2 after irradiation were homogeneous, it means that the doped phosphorus concentrations also homogeneous.
机译:进行了使用多用途核反应堆(MPR-30)的中子嬗变掺杂(NTD)掺杂局部材料硅晶片的电阻率变化。用作本实验的样品用两种本地硅晶片材料。这些局部硅晶片无浅掺杂。第一种具有(0.7960 -0.8010)Ωcm(样品1)之间的电阻率。第二个具有(18.6000-33.0000)Ωcm(样品2)之间的电阻率。用蒸馏水和丙酮清洗样品。用高纯氮气喷涂样品。用HF蚀刻局部硅晶片表面上的天然氧化物层,直至3分钟。将局部硅晶片插入铝管中。铝管的直径为7英寸。高铝管为40厘米。样品1的位置在铝管4cm低于样品2中。在研究核反应堆MPR-30中,用热中子,中子嬗变掺杂(NDT)设施中的局部硅晶片被照射(多目的反应堆-30),印度尼西亚。实验的功率反应堆为15兆瓦(MW)。热中子通量为10〜(12)中子CM〜(-2)S〜(-1)。照射时间为264小时。辐照样品后,将局部硅晶片在700℃的温度下退火1小时。通过四点探针测量局部硅晶片的电阻率。结果表明,在照射前的样品1的平均电阻率为0.8120Ωcm,并在照射后,其电阻率降至0.0673Ωcm。当照射前的样品2的平均电阻率为20.4890Ωcm,照射后,其电阻率降低至0.9730Ωcm。照射后样品1和样品2的电阻率是均匀的,这意味着掺杂的磷浓度也均匀。

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