1. UV/O3 cleaning and DIO3 cleaning process are very effective in removing bulk resin 2. Resin residues and particles are completely removed by SC-1 final cleaning process → Contact angle is hydrophilic (< 10°) 3. Hybrid(UV/O3, DIO3, SC-1) cleaning process can replace SPM cleaning in UV-cured resin removal 4. Acknowledgments This work has been supported by 5. Samsung Advanced Institute of Technology (SAIT) 6. Post BK21 program.
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