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Synthesis of VO_2 thin Films by Atomic Layer Deposition with TEMAV as Precursor

机译:用TemaV作为前体的原子层沉积合成VO_2薄膜

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Synthesis and growth of Vanadium dioxide on Silicon substrates has been investigated by Atomic Layer Deposition (ALD). ALD Vanadium oxide films were synthesized by using the novel Tetrakis[ethylmethylamino] vanadium {V(NEtMe)_4} [TEMAV], as the vanadium precursor source and H_2O vapor as the oxidizing source. The as-prepared ALD thin films were amorphous due to low temperature growth at 150 °C and exhibit a mixture of V_2O_5 and VO_2 phases, which originiate from the V~(4+) and V~(5+) valence states of Vanadium found in the initially amorphous ALD thin film. We found that VO_2 formation is strongly dependent on the amount of pressure and oxygen. The VO_2 films were formed at 450 -500 °C and with an oxygen flow rate of less than 1 sccm in a vacuum of 2.7 E-2 Torr. ALD VO_2 films, after furnace annealing, demonstrate well-formed roundish grains. The ALD VO_2 thin films yielded an rms roughness of 3 nm by AFM analysis and are random polycrystalline after annealing.
机译:用原子层沉积(ALD)研究了二氧化硅钒钒的合成和生长。通过使用新的四甲基甲基氨基]钒{V(Netme)_4} [Temav]作为钒前体源和H_2O蒸汽作为氧化源来合成ALD氧化铝膜。由于150℃的低温生长,所制备的ALD薄膜是无定形的,并且表现出V_2O_5和VO_2阶段的混合物,其从钒的V〜(4 +)和V〜(5+)vAlcence态起源在最初的无定形ALD薄膜中。我们发现VO_2形成强烈依赖于压力和氧气量。 VO_2薄膜在450 -500℃下形成,氧气流速在2.7 e-2托的真空中小于1 sccm。炉退火后ALD VO_2薄膜,展示了形成良好的圆形晶粒。 ALD VO_2薄膜通过AFM分析产生3nm的RMS粗糙度,并在退火后是随机的多晶。

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