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Densificatfon Behavior and Microstructure Evolution of LTCC Film Constrained by Rigid Substrate

机译:刚性基板限制LTCC膜的密度图行为和微观结构演化

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LTCC films constrained by rigid substrate were sintered at different temperatures ranging from 760°C to 800°C. An optical dilatometer together with a rocking arm was employed to record sintering strains of the constrained films during the sintering process. The densification behavior of constrained films was systematically studied through the measured sintering strains by comparing with that of freely sintered films. For the constrained films, the final density was smaller and the activation energy for the densification was larger than that of the freely sintered ones. Moreover, anisotropic microstructure was induced by the tensile stress.
机译:由刚性基板约束的LTCC膜在760℃至800℃的不同温度下烧结。在烧结过程中,使用与摇臂一起与摇臂一起记录受约束膜的烧结菌株。通过与可自由烧结膜进行比较,通过测量的烧结菌株来系统地研究约束膜的致密量行为。对于受约束的薄膜,最终密度较小,并且致密化的活化能量大于自由烧结的薄膜。此外,通过拉伸应力诱导各向异性微观结构。

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