Scalability and Low Cost of Ownership Advantages of Direct Bond Interconnect (DBI) as Drivers for Volume Commercialization of 3-D Integration Architectures and Applications

摘要

Advantages of Direct Bond Interconnect (DBI(r)) technology for the volume commercialization and manufacture of 3-D Integrated Circuits are described. These advantages include low cost resulting from a simplified and high-throughput tool set, scalability resulting from a planar bond surface, and heterogeneous materials integration resulting from a low thermal budget.