Enhancement of Heat dissipation of Desktop Computer Chassis

摘要

The purpose of this study is to find optimal configurations for chassis heat dissipation in a passive fashion, i.e., by arranging the locations and orientations of an additional fan (if any), aided by flow-inducing openings on chassis cover, without making further hardware changes on the current design. Using a CFD software FLUENT, the results were compared with the temperature measurements of each element, and the agreement was favorable. Temperature distributions and flow fields in the chassis are examined. It is concluded that optimal configurations in terms of heat dissipation of chip-based elements do exist with proper conditions of the fan and openings. Also, the occurrence of vortices which results in poor heat dissipation was identified, and the elimination of these vortices was suggested.