Dry Film Resist Microfluidic Channels on Printed Circuit Board and its Application as Fluidic Interconnection for Nanofluidic Chips: Fabrication Challenges

摘要

Nowadays, nanofluidic chips are usually fabricated with silicon and/or glass. A simple and reliable integration packaging method that provides fluidic interconnection to the outside world has not been yet fully developed. The use of PCB material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work.