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Investigation of Interface Between Copper and Carbides Coating Deposited by HVOF Spray Process

机译:HVOF喷涂工艺沉积铜和碳化物涂层界面的研究

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Some research has been made on carbide coatings that were deposited on copper substrate by HVOF. The microstructure of coatings and the interface between coatings and substrate have been investigated by means of scanning electron microscopes (SEM) and transmission electron microscopy (TEM), and the reason for the formation of coatings was analyzed. The results show that the microstructure of the interface between coatings and substrate is complex, which includes amorphous layer and nanocrystal on interface, dislocation cells on copper substrate etc. Amorphous layer is formed from heated adhesion after sudden cooling. Nanocrystal comes from the fragmentation of semi-molten carbide.
机译:已经在通过HVOF沉积在铜基材上的碳化物涂层上进行了一些研究。通过扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了涂层和涂层和基板之间的界面的微观结构,分析了涂层形成的原因。结果表明,涂​​层和衬底之间的界面的微观结构是复杂的,其包括在界面上的无定形层和纳米晶体,铜基板上的位错细胞等。无定形层在突然冷却后由加热的粘合形成。纳米晶胞来自半熔融碳化物的碎裂。

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