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PROPERTIES OF THE INTERFACIAL LAYER IN THE HIGH-K GATE STACK AND TRANSISTOR PERFORMANCE

机译:高k栅极堆叠和晶体管性能中的界面层的性质

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Effect of the ALD Hft>2 film on the structural and electrical properties of the underlying interfacial SiC>2 layer is discussed. It is shown that the k value of the interfacial layer is increased, which may be caused by the removal of oxygen atom from the oxide region near its interface with the Si substrate. The data indicates that the low temperature chemical oxide may be less stable than thermal oxide with respect to oxygen removal. Chemical oxide interfacial layer exhibits higher density of the fixed charge compared with thermal oxide that correlates to lower mobility observed in the gate stack with the chemical oxide interface.
机译:讨论了ALD HFT> 2膜对底层界面SiC> 2层的结构和电性能的影响。结果表明,界面层的k值增加,这可能是由与Si衬底接近邻接附近的氧化物区域的氧原子引起的。数据表明,低温化学氧化物可能比相对于氧除去的热氧化物稳定。与具有化学氧化物界面的栅极堆叠中观察到的较低迁移率相关的热氧化物相比,化学氧化物界面层具有更高的固定电荷密度。

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