Soluble intrinsically photosensitive poly(amide-co-imide)s containing p-phenylenediacryloyl moiety

摘要

Photosensitive polyimides have been widely used in electronic industry as an low-dielectric material due to their high temperature resistance,good mechanical properties,and low dielectric property.Compared with ordinary polyimides functioned as low-dielectric interlayer,photosensitive polyimides also provide an advantage of simple processing method for micro-patterning of polyimide layer,since patterning of ordinary polyimides is achieved by an extraprocessing technique that includes lithography via photoresists.