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Comparison of Mercuric Iodide and Lead Iodide X-Ray Detectors for X-ray Imaging Applications

机译:X射线成像应用的酰胺碘化物和铅碘化物X射线探测器的比较

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Mercuric iodide (HgI{sub}2) and lead iodide (PbI{sub}2) have been under development for several years as direct converter layers for digital x-ray imaging. We deposited these materials on flat panel thin film transistor (TFT) arrays and found that they are good candidates for x-ray imaging applications in medical imaging, security applications, and Non Destructive Testing (NDT). This paper present basic imaging parameters and compares both lead iodide and mercuric iodide imagers. A difficult challenge of both lead iodide and mercuric iodide is the higher than desired leakage currents. These currents are influenced by factors such as applied electrical field, layer thickness, layer density, electrode structure and material purity. Minimizing the leakage current must also be achieved without adversely affecting charge transport, which plays a large role in gain and is influenced by these parameters. New deposition and annealing technologies have been developed through which the leakage current has now decreased by more than an order of magnitude while showing no negative affects on gam. Other challenges relate to increasing film thickness without degrading electrical properties. Both lead iodide and mercuric iodide were vacuum deposited by Physical Vapor Deposition (PVD) on a-Si TFT arrays with 127μm pixel pitch. This coating technology is scalable to sizes required in common x-ray imaging applications, as proven by the present 4"×4" and 8"×10" imager results [4]. The imagers were evaluated for both radiographic and fluoroscopic imaging. Modulation Transfer Function (MTF) was measured as a function of the spatial frequency. The MTF data were compared to values published in the literature for indirect detectors (CsI). Resolution tests on resolution target phantoms showed that resolution is limited by the TFT array Nyquist frequency (~3.9 lp/mm). The ability to operate at moderate voltages (~0.5-1.0 V/μm) provides acceptable dark current for most applications and permits low voltage electronics design. Image lag characteristics of mercuric iodide appear adequate for fluoroscopic rates. The structure and x-ray diffraction data of the two materials were compared to explain the difference in image lag between them.
机译:碘化汞(HGI {子} 2)和碘化铅(PBI {子} 2)已在开发了数年,作为数字x射线成像的直接转换器层。我们沉积在平板薄膜晶体管(TFT)阵列,发现它们是良好的候选用于医学成像,安全应用X射线成像应用中,这些材料和无损检测(NDT)。本文存在的碱性成像参数和两个碘化铅和碘化汞成像器进行比较。既碘化铅和碘化汞的一个困难的挑战是比期望的泄漏电流就越高。这些电流由因素的影响,例如施加的电场,层厚度,层的密度,电极的结构和材料的纯度。最大限度地减少漏电流也必须无电荷传输,这在增益起到了很大的作用,并通过这些参数的影响产生不利影响来实现的。新的沉积和退火技术已经被开发,通过该泄漏电流已经下降超过一个数量级,而没有显示出负对GAM影响。相关的其他挑战增加膜厚度而不降低电性能。上的a-Si TFT阵列与127μm像素间距都碘化铅和碘化汞真空沉积通过物理气相沉积(PVD)。这种涂层的技术是可扩展的,以在普通X射线成像应用所需要的尺寸,由本4“×4”和8“×10”成像器的效果[4]所证明。成像器两个放射线照相和荧光透视成像的评价。调制传递函数(MTF),测定作为空间频率的函数。的MTF数据进行比较,以文献中公布的用于间接检测器(CSI)的值。上的分辨率目标幻影分辨率测试表明,分辨率是由TFT阵列奈奎斯特频率(〜3.9线对/毫米)的限制。在中等电压下进行操作的能力(〜0.5-1.0 V /微米)提供大部分应用是可接受的暗电流,并且允许低电压电子设计。碘化汞的图像滞后特性出现足够透视率。两种材料的结构和X射线衍射数据进行比较,以解释在它们之间图像滞后的差。

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