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Effect of Current Density on Pore Formation in n-InP in KOH

机译:电流密度对KOH N-INP孔隙形成的影响

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InP samples which were galvanostatically anodised in 5 mol dm~(-3) KOH exhibited crystallographic pore etching at current densities ranging from 1 mA cm~(-2) to 20 mA cm~(-2). Surprisingly, the total charge at growth termination (~1.8 C cm~(-2)) and the corresponding layer thickness (~3.0 μm) were independent of current density in experiments at continuous constant current. Surface pit density was proportional to current density, indicating that the average current per pit was 1.7 pA, independent of current density. The influence of mass transport on the termination of porous layer growth was demonstrated in an experiment at low current density where the current was interrupted a number of times before layer growth ended. At low current densities, pores had sharp tips, triangular cross-sections and large pore widths. At higher current densities, both the pore tips and the pore cross-sections became more rounded while the pore width decreased. These variations are explained in terms of the effect that different rates of hole supply (at different current densities) can have on the rate of indium vacancy formation on the three {111}A faces that make up the pore tip.
机译:在5mol DM〜(-3)KOH中的INP样品在5mol DM〜(-3)KOH中,在电流密度范围为1mA cm〜(-2)至20mA cm〜(-2)。令人惊讶的是,生长终止(〜1.8ccm〜(-2))的总电荷和相应的层厚度(〜3.0μm)与连续恒定电流的实验中的电流密度无关。表面凹坑密度与电流密度成比例,表明每个坑的平均电流为1.7Pa,与电流密度无关。在低电流密度的实验中,在低电流密度的实验中证明了质量传输对多孔层生长的影响,其中在层生长结束前电流被中断了多次。在低电流密度下,孔隙具有尖锐的尖端,三角形横截面和大的孔宽度。在较高的电流密度下,孔径和孔横截面都变得更加圆润,而孔宽度降低。这些变型在孔电源(在不同电流密度)的不同速率可能对构成孔尖的面孔上的铟空位形成的效果方面解释。

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