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p-to-n ion-beam milling conversion in specially doped CdxHg1-xTe

机译:P-TO-N专门掺杂CDXHG1-XTE中的离子束铣削转换

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Ion beam milling effect on electrical properties of usual vacancy doped and especially In compensated p-Cd$-x$/Hg$- 1$MIN@x$/Te has been investigated. In all cases after ion beam milling by low energy neutralized. Ar ions n-p structure with thickness of n-layers that depended on initial hole concentration and irradiation dose has been created. It was shown that in the usual vacancy doped Cd$- x$/Hg$-1$MIN@x$/Te the electron concentration in n-layers well agrees with concentration of residual donors. For the especially doped samples the electron concentration was determined by the In donor impurities' concentration. The possibility of the n-p$+$PLU$/ Cd$-x$/Hg$-1$MIN@x$/Te photodiode fabrication with optimum required carriers' concentration both in n- and p-regions has been demonstrated by ion beam milling of the especially doped samples.
机译:离子梁铣削对通常空缺掺杂的电气性质的影响,特别是补偿P-CD $ -X $ / hg $ - 1 $ MIN @ $ / TE已经调查。在离子束铣削后的所有情况下,通过低能量中和。已经产生依赖于依赖于初始空穴浓度和照射剂量的N层的N-P结构。结果表明,在通常的空缺掺杂CD $ - x $ / hg $ -1 $ min @ x $ / te n层中的电子浓度很好地同意浓度的残余供体。对于特别是掺杂的样品,电子浓度由供体杂质浓度确定。通过离子束证明了NP $ + $ / HG $ / CD $ -X $ / hg $-cd $ -x $ / hg $ -1min @ x $ / te photodiode制造n-和p区内的最佳载体浓度的浓度铣削特别掺杂的样品。

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