3D Interconnects — The enabler of next generation multi-Gbps single-ended bus

摘要

The rising demands of miniaturize and high performance electronic gadgets necessitates higher density with higher bandwidth interconnect which is being limited by prevailing microwave effects as signaling data-rate surges and routing pitch shrinks. This paper presents a transmission line design with three-dimentional (3D) reference plane to alleviate the signaling crosstalk impacts that limit the performance scaling of high-speed parallel bus design such as on-package interconnects (OPI). Simulation result indicates eye opening improvements of >40% for OPI bus operates at 4Gbps data rate is feasibible with the crosstalk reduction achieved through the 3D reference plane design.