首页> 外文会议>Technical Conference of the Society of Plastics Engineers >Precision Micro Feature Moulding Using Vacuum Assisted Moulding Technique For Polymeric Microfluidic Chip Applications
【24h】

Precision Micro Feature Moulding Using Vacuum Assisted Moulding Technique For Polymeric Microfluidic Chip Applications

机译:使用真空辅助模塑技术进行精密微功能模塑技术,用于聚合物微流体芯片应用

获取原文

摘要

In the precision moulding of polymeric microfluidic chips with designs of complicated channel structure, precision moulding of micro features with sizes down to microns and sub-micrometers are often required. In order to successfully fill these micro features on mould cavity during injection moulding, the management of cavity entrapped air is critical for minimizing the variation in melt pressure distribution during the injection phase and also avoids polymer degradation at the last filling zone. In this paper, an investigation study was conducted to evaluate the effects of vacuum assist moulding on chip flatness and the micro-feature replication accuracy of the polymeric microfluidic chips as compared to conventional injection moulding process. Process optimization with the Design of Experiment (DOE) method is used to optimize the processing conditions which defined a processing window for the vacuum assisted micro-injection moulding process. The replication accuracy of vacuum assisted moulded polymeric chips achieved less than 1% error compared to the actual insert dimension. The overall warpage was controlled within 15um, which is better than that achieved by conventional micro-moulding process.
机译:在具有复杂通道结构设计的聚合物微流体芯片的精密模塑中,通常需要具有尺寸的微观特征和亚微米的微观特征。为了在注射成型期间成功填充模具腔上的这些微特征,腔夹空气的管理对于在注射阶段期间最小化熔体压力分布的变化至关重要,并且还避免了最后填充区的聚合物降解。在本文中,与常规注射成型工艺相比,进行了调查研究以评估真空辅助模塑对芯片平坦度和聚合物微流体芯片的微观特征复合精度的影响。使用实验设计(DOE)方法的过程优化用于优化用于真空辅助微注射成型工艺的处理窗口的处理条件。与实际插入尺寸相比,真空辅助模塑聚合物芯片的复制精度达到小于1%误差。将整体翘曲控制在15um内,比通过常规微模制方法实现更好。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号