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Gamma radiation response for SOI MOSFETs fabricated on DeleCut and Unibond wafers

机译:在Delecut和Unibond晶片上制造的SOI MOSFET的伽马辐射响应

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摘要

The gamma radiation tolerance of silicon on insulator technology on Dele-Cut and Unibond materials was studied. The radiation response is characterized by threshold-voltage shifts of the back-gate n-channel SOI MOSFETs. The density of the effective positively charge accumulated in buried oxide after γ-irradiation at dose 1 Mrad was found to be 1.3·1012 cm−2 and 2.1·1012 cm−2 for Dele-Cut and Unibond wafers, respectively.
机译:研究了DELE-CUT和UNIBOND材料绝缘技术硅硅辐射耐受性。辐射响应的特征在于后栅极N沟道SOI MOSFET的阈值电压偏移。在剂量1 mrad下γ-辐射后累积在埋下氧化物中的有效带正电荷的密度为1.3·10 12℃ -2 和2.1·10 12 cm -2 -2 ,用于删除和单边晶圆。

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