Flame Retardancy of Chemically Modified Lignin as Functional Additive to Epoxy Nanocomposites

摘要

Epoxy printed circuit boards are used in a variety of electronics applications as rigid, thermally stable substrates. Due to the propensity of components on the boards, such as batteries and interconnects, to fail and ignite the epoxy, flame retardant additives are required to minimize fire risk. Currently, industry uses brominated flame retardants, such as TBBPA, to meet regulatory requirements. However, recently, a number of environmental and human health issues have been raised about brominated compounds components, so there is a desire to develop alternative flame retardant chemistries.