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Effect of chemical etching on the surface roughness of CdZnTe and CdMnTe gamma radiation detectors

机译:化学蚀刻对CDZNTE和CDMNTE伽马辐射探测器表面粗糙度的影响

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Generally, mechanical polishing is performed to diminish the cutting damage followed by chemical etching to remove the remaining damage on crystal surfaces. In this paper, we detail the findings from our study of the effects of various chemical treatments on the roughness of crystal surfaces. We prepared several CdZnTe (CZT) and CdMnTe ( CMT) crystals by mechanical polishing with 5 gm and/or lower grits of Al_2O_3 abrasive papers including final polishing with 0.05-μm particle size alumina powder and then etched them for different periods with a 2%, 5% Bromine-Methanol (B-M) solution, and also with an E-solution (HNO_3:H_2O:K_2Cr_2O7). The material removal rate (etching rate) from the crystals was found to be 10 pm, 30 μm, and 15 μm per minute, respectively. The roughness of the resulting surfaces was determined by the Atomic Force Microscopy (AFM) to identify the most efficient surface processing method by combining mechanical and chemical polishing.
机译:通常,进行机械抛光以减小切削损伤,然后通过化学蚀刻来除去晶体表面上的剩余损伤。在本文中,我们从研究各种化学处理对晶体表面粗糙度的影响的研究详细说明了研究结果。通过使用0.05μm粒度氧化铝粉末的5克和/或较低的砂纸制备几种Cdznte(CDT)和Cdmnte(CMT)晶体,包括最终抛光,然后用0.05μm粒径氧化铝粉末蚀刻它们,以2%的不同时期蚀刻它们,5%溴 - 甲醇(BM)溶液,还具有E-溶液(HNO_3:H_2O:K_2CR_2O7)。从晶体中的材料去除速率(蚀刻速率)分别为每分钟10μm,30μm和15μm。通过原子力显微镜(AFM)确定所得表面的粗糙度,以通过组合机械和化学抛光来识别最有效的表面处理方法。

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