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Effect of Thermal Contact Resistance on Alumina Molten Particle Impacting onto a Metal Substrate

机译:热接触电阻对氧化铝熔融颗粒冲击金属基材的影响

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In this paper, a Finite Element Analysis is carried out in order to simulate the process of spreading and solidification of a micrometric molten droplet impinging onto a cold substrate. This process is a crucial key to have a good understanding of coatings obtained by means of thermal spraying. The effect of thermal contact resistance (TCR) on the droplet spreading and solidification was investigated using different values of TCR and different droplet sizes. The solidification time was found to be a linear function of the droplet diameter square. Viscous dissipation, wettability and surface tension effects are taken into account. The Level Set method was employed to explicitly track the free surface of molten droplets.
机译:在本文中,进行了有限元分析,以模拟撞击撞击冷基质上的微米熔融液滴的扩散和凝固过程。该过程是对通过热喷涂获得的涂层的良好理解至关重要的关键。使用不同的TCR和不同液滴尺寸的不同值研究了热接触电阻(TCR)对液滴扩散和凝固的影响。发现凝固时间是液滴直径正方形的线性函数。考虑粘性耗散,润湿性和表面张力效应。采用水平设定方法,明确地跟踪熔融液滴的自由表面。

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