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First fully CMOS-integrated 3D Hall probe

机译:第一个完全CMOS集成的3D霍尔探头

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We present the first fully CMOS-integrated 3D Hall probe. The microsystem is developed for precise magnetic field measurements in the range from mT up to tens of tesla in the frequency range from DC to 30 kHz and with a spatial resolution of about 150 /spl mu/m. The microsystem is realized in a conventional CMOS process without any additional processing step and can be manufactured at very low cost. With the electronics circuit applying the so-called spinning-current technique to the Hall sensor block, we obtain low noise (a resolution better than 100 /spl mu/T) and low cross talk between the channels (less than 0.2% between the channels up to 2 T). The single chip configuration insures a precision of the orthogonality between the measurement axes better than 0.5/spl deg/. A temperature sensor based on a band-gap cell is integrated directly on the chip, which allows a good temperature drift compensation of the system.
机译:我们介绍了第一个完全CMOS集成的3D Hall探头。微系统是为精确的磁场测量开发的,从DC到30kHz的频率范围内的MT高达数十台的TESLA,并且空间分辨率为约150 / SPL MU / m。微系统在传统的CMOS工艺中实现,没有任何额外的处理步骤,并且可以以非常低的成本制造。使用电子电路将所谓的旋转电流技术应用于霍尔传感器块,我们获得低噪声(优于100 / SPL MU / T的分辨率),并且在通道之间的横跨交叉口交(频道之间小于0.2%最多2吨)。单芯片配置确保了比0.5 / SPL DEG /的测量轴之间的正交性精确度。基于带间隙电池的温度传感器直接集成在芯片上,这允许系统的良好温度漂移补偿。

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