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Ultra shallow As profiling before and after spike annealing using medium energy ion scattering

机译:超浅作为刻划前后的刻划退火使用中等能量离子散射

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Ultra shallow arsenic profiles implanted into Si with an energy range from 0.5 to 3 keV to a dose of 8/spl times/10/sup 14/ ions/cm/sup 2/ before and after spike annealing were measured by medium energy ion scattering (MEIS) with a toroidal electrostatic analyzer (TEA). A shift of the peak of arsenic profile to the surface after spike annealing was observed by MEIS measurement. Most of the implanted arsenic atoms were trapped in the native oxide layer after spike annealing.
机译:通过中测量的能量离子散射测量植入0.5至3keV的能量范围为0.5至3keV的能量范围为8 / SPL时/ 10 / SOP 2 /之前和之后的能量范围为8 / SPL时间/ 10 / SOP 2 /之前和之后的能量范围。梅斯)带环形静电分析仪(茶)。通过MEIS测量观察到尖峰退火后砷曲线峰的峰值偏移。大多数植入的砷原子被捕获在尖刺退火后的天然氧化物层中。

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