首页> 外文会议>Annual meeting of the adhesion society >ADHESION OF DIELECTRIC MATERIALS TO METAL OXIDES, SILICON OXIDE AND SILICON NITRIDE
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ADHESION OF DIELECTRIC MATERIALS TO METAL OXIDES, SILICON OXIDE AND SILICON NITRIDE

机译:介电材料与金属氧化物,氧化硅和氮化硅的粘附性

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An analytical method to determine the amount of adhesion promoter is discovered. The amount of silane couplers such as AAPS and 3-APS on a rough or flat surface of metal oxides could be determined with the ratio of atomic concentrations and/or the ratio of two O_1s bands in XPS. Practical adhesion strength is determined by 90 °peel test for which a thin ( ~20 μm) layer of polyimide is employed as a peel-backing layer. The locus of failure usually determined with XPS is indicative of poor or good adhesion.
机译:发现了确定粘合促进剂量的分析方法。可以用原子浓度的比率和/或XPS中的两个O_1S带的比率确定金属氧化物的粗糙或平坦表面上的硅烷偶联剂和3-AP的量。实际粘合强度由90°剥离试验测定,其中薄(〜20μm)聚酰亚胺是用作剥离背衬层的薄(〜20μm)。通常用XPS确定的失败轨迹指示差或良好的粘合性。

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