The trend in the semiconductor industry is to develop more powerful components while decreasing the component size. By stacking multiple dies into a single package, the overall package footprint can be reduced dramatically. A suitable material set has to be obtained for the required reliability performance. The objective of this study is to evaluate the performance of different die attach films and paste on the package. The strengths and weaknesses of the die attach materials are compared in term of the material performance, cost manufacturing process, and package stress induced. Both experimental and modeling works are resorted to analyze and refine the package design. Finite element model of the package is generated to determine the thermally induced stresses and package warpage. This three-dimensional technology is considered by industry experts as the key solution to bridge the gap between future requirements and current capability for a wide range of applications. It represents the next wave of packaging innovation and will see sharp growth in the years to come.
展开▼
