Laser Processing of Direct-Write Resistor Paste

摘要

Direct-write laser-processing techniques were used to thermally process resistor paste materials. Lines of resistor pastes were deposited and irradiated by a continuous-wave laser with varied translation speeds (v) and power densities or irradiances (H). The values of v and H over the processed media were optimized to achieve complete densification. The optimal resistor materials exhibited good adhesion to the substrate, complete densification, and electrical- resistance tolerances equivalent to traditional oven-fired materials. Processing conditions outside the optimal region resulted in line delamination, incomplete densification, and various forms of line deformation.