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Non-destructive food-sterility and package-quality testing of aseptically packed food products by impedance measurements

机译:通过阻抗测量的无菌填充食品的无损食品无菌和包装质量测试

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An impedance method for simultaneous non-destructive package-quality and food-sterility testing of aseptically packed food products is presented. The method is intended for 100% on-line testing of TBA (Tetra Brik Aseptic) food containers.An electric model has been developed for the measured impedance. A relation is derived between the resistive component of the measured impedance and the conductivity of the food. The impact of local disintegration of the inner thermoplastic layer of thepackaging material (local leakage) on the measurement impedance is analyzed.The experimental results prove the rapidity and the sensitivity of the method. They also show that we can even roughly determine the size of the leakage area and the distance between its location and a reference point.
机译:介绍了无菌上包装食品的同步无损包装质量和食品无菌检测的阻抗方法。该方法适用于TBA(Tetra Brik无菌)食品容器的100%在线测试。已经为测量的阻抗开发了电气模型。在测量阻抗和食物的电导率之间导出的关系。分析了在测量阻抗的包装材料内部热塑性层(局部泄漏)的局部崩解的影响。实验结果证明了该方法的速度和灵敏度。他们还表明,我们甚至可以大致确定泄漏面积的大小和其位置与参考点之间的距离。

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