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Comparison between polysilicon thin films obtained by CW and pulsed laser sources

机译:CW和脉冲激光源获得的多晶硅薄膜之间的比较

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Polysilicon thin films on glass substrates have been obtained by Laser Induced Crystallization utilizing two different lasers: a Q-switched diode pumped, frequency-doubled Nd:YLF laser at 523 nm wavelength and a CW Ar{sup}+ laser at 514.5 nm wavelength. Low Pressure Chemical Vapor Deposition (LPCVD) technique has been utilized to prepare intrinsic amorphous films of different thickness. Irradiation parameters of both lasers have been varied in order to study their influence on crystallized material properties. SEM analysis has been applied to determine the grain size and their distribution. Microstructural information is obtained by XRD technique. Optical properties of as-deposited and crystallized films have been determined. Crystallization process by pulsed laser produces materials with grain size larger than that obtained by CW laser, and the best result has been obtained on materials having thickness of 50 nm.
机译:通过激光诱导的结晶,使用两个不同的激光器获得多晶硅薄膜:Q切换二极管泵送,频率加倍的Nd:YlF激光器在523nm波长和514.5nm波长下的CW ar {sup} +激光。低压化学气相沉积(LPCVD)技术已经利用来制备不同厚度的内在非晶膜。两种激光的照射参数已经变化,以研究它们对结晶材料性能的影响。 SEM分析已应用于确定晶粒尺寸及其分布。通过XRD技术获得微结构信息。已经确定了沉积的和结晶膜的光学性质。脉冲激光的结晶过程产生晶粒尺寸大于CW激光器的材料,并且在具有50nm的材料上获得了最佳结果。

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