Effect of Hook Location for Ultra Fine Pitch Wireboncfing Pull Testing Method

摘要

Over the years the methods for checking bonding quality during volume production still remains the same. These inspection methods like ball shear to test the first bond quality and wire pull to test the second bond integrity and quality have proven to be acceptable and achievable for many current industrial needs. However, driven by the relentless pursuit of dimensional reduction in wire bonding technology which calls for reduction in wire diameter, these conventional methods may not be sufficient. The interaction between machine, bonding tools, materials and the different categories of failure modes and mechanism during this quality test has become much more sensitive.