A discussion on the modelling of grinding and polishing

摘要

This paper discusses some problems of modelling in polishing and grinding. The issues were addressed through examples of the finite element analysis of grinding, dimensional analysis of polishing and characterisation of non-linear deformation in mono-crystalline silicon due to grinding, polishing and indentation. It showed that modelling of polishing and grinding can be carried out by various means but is still an open problem in general in terms of quantitative and reliable predictions.