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Analysis of friction and wear properties of CVD-SiC film with ELID-grinding

机译:用ELID磨削CVD-SIC膜的摩擦磨损性能分析

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The purpose of this investigation is to analyze the friction and wear properties of CVD-SiC films finished with ELID-grinding and ordinary grinding at dry condition. Normal load is changed from 0.049N to 98N. The following results are obtained. Friction coefficient of CVD-SiC film finished with two kinds of grinding methods show similar results. Specific wear rate of CVD-SiC film with ELID-grinding does not depend on the grinding direction. Wear mode are classified into two types, powder formation (ws≤10{sup}(-9) mm{sup}2/N) and without powder formation. (ws≤3×10{sup}(-10) mm{sup}2/N) CVD-SiC film with ELID-grinding showed high wear resistance because wear mode of powder formation did not occur when P{sub}(max) is less than P{sub}(max.c). Transition between powder formation and without powder formation is explained in terms of the dimensionless parameter (S{sub}C){sup}*.
机译:本研究的目的是分析CVD-SIC薄膜的摩擦和磨损性能,在干燥条件下用ELID研磨和普通研磨完成。正常负载从0.049n变为98n。获得以下结果。 CVD-SIC膜的摩擦系数用两种研磨方法完成了类似的结果。具有ELID磨削的CVD-SIC膜的特定磨损不依赖于研磨方向。磨损模式分为两种类型,粉末形成(WS≤10{sup}( - 9)mm {sup} 2 / n),没有粉末形成。 (WS≤3×10 {sup}( - 10)mm {sup} 2 / n)CVD-SiC膜,具有ELID研磨,显示出高耐磨性,因为P {SUB}(最大)时不会发生粉末形成的磨损模式小于p {sub}(max.c)。粉末形成和没有粉末形成之间的过渡就无维参数(S {sub} c){sup} *而解释。

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