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Growth of silicon carbide ingots by the modified Lely method with 'in situ' sublimation etching

机译:通过“原位”升华蚀刻的改性纤维法生长碳化硅锭的生长

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6H-SiC single crystal ingots up to 1 inch in diameter with (10~4-10~5) cm~(-2) etch pit densities have been grown by the Modified Lely Method using "in situ" sublimation etching. It is shown that by this way it is possible to improve the quality of the seed-ingot interface and to decrease the density of pinholes and dislocations.
机译:6H-SiC单晶锭直径高达1英寸(10〜4-10〜5)cm〜(2)蚀刻坑密度,通过“原位”升华蚀刻,通过改进的纤维方法已经生长。结果表明,通过这种方式,可以提高种子铸锭界面的质量并降低针孔和脱位的密度。

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