首页> 外文会议>Integrated Reliability Workshop Final Report, 2005 IEEE International >One time programming device yield study based on anti-fuse gate oxide breakdown on p-type and n-type substrates
【24h】

One time programming device yield study based on anti-fuse gate oxide breakdown on p-type and n-type substrates

机译:基于对p型和n型衬底的反熔丝栅氧化物击穿的一次性编程器件良率研究

获取原文

摘要

A study on the programming yield of one time programmable (OTP) device based on anti-fuse gate oxide breakdown on p-type and n-type substrates is presented. Charge injection into anti-fuse gate oxide from the substrate during OTP programming can alter device characteristics, which impact the OTP programming yield. Experiments showed higher programming yield with increasing anti-fuse gate read current can be obtained with the OTP device based on anti-fuse gate oxide breakdown on n-type substrate compared to p-type substrate due to less electron-hole pair generation.
机译:提出了一种基于反熔丝栅氧化物击穿p型和n型衬底的一次性可编程(OTP)器件的编程产量的方法。在OTP编程过程中,将电荷从衬底注入反熔丝栅氧化物中会改变器件的特性,从而影响OTP编程的良率。实验表明,由于电子空穴对的产生较少,因此与基于p型衬底的n型衬底相比,基于n型衬底上的反熔丝栅氧化物击穿的OTP器件可以提高反熔丝栅读取电流,从而提高编程产量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号