Solder paste is used in a variety of applications across the globe. The performance of solder paste is crucial in the SMT process; therefore knowing how the environment affects the printing of paste is extremely valuable. It can be challenging for print operators to regulate the variability of working environments. The different environment variables that need to be regulated are temperature, humidity and type of solder paste. This study explores the performance of no clean and water soluble pastes in environmental conditions such as, elevated temperatures, decreased temperatures, and high and low relative humidity. The data gathered throughout this study consists of printed volume measurements with aperture sizes ranging from 0.35 – 0.80 area ratio. Tack force and slump was measured for each test condition.
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