What is needed to Successfully Introduce “Device Embedding Technology” in Design and Manufacturing of PCBs and PCBAs to Add Value to Your Products?”

摘要

The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have been developed and were technically successful, but history has shown that these embedding developments did not result in a sustainable success over a longer period of time. Replacement technologies have been developed after a short period of time by the so-called “Not in Kind” (NiK) technologies often called disruptive technology. (e.g. From the viewpoint of a PCB fabricator the use of an “Inorganic ceramic material is a = “Not in Kind”, while a standard FR4.0 or FR4.1 is considered as an Organic = “In Kind” technology). The paper will explain what is needed to avoid technology pitfalls that will lead to business failures in future. In addition, opportunities are discussed that enable development managers, design engineers and specialists to use the full benefits of embedding devices in automotive, medical and industrial applications. These ‘enabling’ manufacturing technologies will offer the opportunity to develop innovative product solutions in critical technical, environmental and business situations.