High density fine pitch components continue to push PCB surface circuit geometry. In addition, sensors and other RF applications require precision in dielectrics and surface conductors. Using paste interconnects, the PCB manufacturer can interconnect a double sided “Cap” without the use of any plating. Using a paste wrap, layers 1, 2 or 3 may be interconnected in any combination. This both streamlines the manufacturing process, and has the benefit of making mix dielectrics easier to manufacture. In addition, the surface copper may be “print and etch” only for precision RF applications.
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