With the electronic industry moving towards lead-free assembly, traditional SnPb-compatible laminates need to be replacedwith lead-free compatible laminates that can withstand the higher reflow temperature required by lead-free solders. Lead-freecompatible laminates with improved heat resistance have been developed to meet this challenge but they are typically morebrittle than SnPb laminates causing some to be more susceptible to pad cratering. In this paper, two novel approaches forminimizing pad cratering will be discussed. Preliminary results which validate the two approaches will also be presented.
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