Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

摘要

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designersmust adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M(0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mountcomponent miniaturization.This presentation will explore board and component trends, and then delve into three critical areas for successful 03015Madoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance oftaping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine howAdaptive Process Control can increase production yields and reduce defects by placing components to solder position ratherthan pad. Understanding the process considerations for 03015M component mounting today will help designers andmanufacturers transition to successful placement tomorrow.