Design and Verification of Teststructures for Complex Multilayer-PCB Interconnections

摘要

A concept for the evaluation of complex multilayer interconnections is proposed. The presented work includes the design and evaluation of a test PCB for complex multilayer structures in Ku-Band. The focus of the designed PCB is the characterization of inter-layer and inter-PCB transitions using a combination of typical calibration methods with time domain gating analysis.