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Advanced chip package of a fiber coupled superconducting single photon detector for a closed-cycle cryostat

机译:闭环低温恒温器光纤耦合超导单光子探测器的先进芯片封装

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Superconducting single photon detectors are promising candidates for cutting-edge applications like space-to-ground communication and quantum-key-distribution. The challenge is to transfer the assembly technology from university research to industrial processes. Especially the positioning of the optical fiber with respect to the active area of the superconducting detector are open questions. We demonstrate the operation of a superconducting nanowire single photon detector (SNSPD) in a closed cycle cryostat. The thermal coupling between superconducting detector chip and closed-cycle cryostat is investigated. The possibility to mount the optical fiber in an RIE-ICP-etched hole in a silicon carrier wafer is demonstrated. Different illumination wavelength and intensities are used to validate the SNSPD assembly in the closed cycle cryostat. Further, an advanced package of the silicon carrier wafer and the SNSPD-chip is introduced. In this package, the SNSPD-chip is mounted via flip-chip technology on the silicon carrier wafer. The striven flip-chip position accuracy of ± 1 μm ensures the accurate coupling between optical fiber and active area of the SNSPD.
机译:超导单光子探测器是诸如空对地通信和量子密钥分配等尖端应用的有前途的候选者。挑战是将组装技术从大学研究转移到工业过程。尤其是光纤相对于超导检测器的有效区域的定位是悬而未决的问题。我们演示了在闭环低温恒温器中超导纳米线单光子探测器(SNSPD)的操作。研究了超导检测器芯片与闭环低温恒温器之间的热耦合。说明了将光纤安装在硅载体晶片的RIE-ICP蚀刻孔中的可能性。使用不同的照明波长和强度来验证闭环低温恒温器中的SNSPD组件。此外,介绍了硅载体晶片和SNSPD芯片的高级封装。在该封装中,SNSPD芯片通过倒装芯片技术安装在硅载体晶圆上。可靠的倒装芯片位置精度为±1μm,可确保光纤与SNSPD有源区域之间的精确耦合。

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