A Low Profile Folded Dipole Antenna on a Reactive High Impedance Substrate

摘要

We present a fully planar realization of a low profile dipole antenna placed on top of a high impedance substrate. The structure is made by three metal layers and it does not requires vias between the layers. The antenna is matched to 50 Ohms and has a gain of 7.1dBi including all feed network losses.