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Analytical Drain Current Model For Damaged Gate All Around (GAA) MOSFET Including Quantum and Velocity Overshoot Effects

机译:损坏的全栅(GAA)MOSFET的分析漏电流模型,包括量子和速度过冲效应

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In this paper an analytical drain current model has been developed for Cylindrical Gate All Around (GAA) Si Nanowire MOSFET having interface fixed charges due to hot carrier/process/stress/radiation induced damage. The model also includes quantum and velocity overshoot effects. The effect of interface fixed charges on threshold voltage and drain current has been studied quantitatively and threshold voltage shift and change in off current are used to extract the density of fixed charges present at the Si-SiO_2 interface of the damaged device. Simulation results using ATLAS 3D device simulator are used to verify the validity of this model, and quite good agreement is obtained for various cases of channel length and channel radius.
机译:在本文中,已经开发出了一种分析漏电流模型,该模型适用于圆柱形栅极全向(GAA)Si纳米线MOSFET,由于热载流子/过程/应力/辐射引起的损坏,其界面固定电荷。该模型还包括量子和速度超调效应。定量研究了界面固定电荷对阈值电压和漏极电流的影响,并使用阈值电压偏移和关断电流的变化来提取损坏器件的Si-SiO_2界面上存在的固定电荷的密度。使用ATLAS 3D设备仿真器的仿真结果验证了该模型的有效性,并且在各种情况下通道长度和通道半径方面都获得了很好的一致性。

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