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Investigation on the Electric-Field-Induced Metal-Insulator Transition In Vox-Based Devices

机译:Vox基器件中电场诱导的金属-绝缘体转变的研究

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A sandwich device structure of MIM (metal/insulator/metal) is designed and its metalinsulator transition induced by an external electric field is investigated. VOX films were deposited on several different substrates by dc magnetic sputtering at room temperature. The device of Pt/VOx/Cu/Ti/SiO2/Si exhibited steady bipolar resistance switching behaviors between high resistive state (HRS) and low resistive state (LRS) with 0.4V/0.3V operation voltages (SET/RESET), while the devices of Pt/VO/V7Cu/Ti/SiO2/Si, - Pt/VOx/Al/Ti/SiO2/Si and Pt/VOx/Pt/Ti/SiO2/Si didn't show this steady characteristic. From the comparison of these devices based on different substrates, the Schottky Emission model was quoted to explain this resistance switching characteristic in Pt/VOx/Cu/Ti/SiO2/Si device.
机译:设计了MIM(金属/绝缘体/金属)的夹层器件结构,并研究了由外部电场引起的金属化器过渡。通过在室温下通过DC磁性溅射在几种不同的基材上沉积VOX薄膜。 Pt / Vox / Cu / Ti / SiO2 / Si的装置在高电阻状态(HRS)和低电阻状态(LRS)之间具有0.4V / 0.3V操作电压(设定/复位)之间的稳定双极性切换行为。 PT / VO / V7CU / TI / SIO2 / SI的装置, - PT / VOX / AL / TI / SIO2 / SI和PT / VOX / PT / TI / SIO2 / SI没有显示出这种稳定的特色。根据基于不同基板的这些器件的比较,引用了肖特基发射模型以解释Pt / Vox / Cu / Ti / SiO2 / Si器件中的这种电阻切换特性。

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