首页> 外文会议>Silicon carbide and related materials 2009 >Significant decrease of the interface state density by NH_3 plasma pretreatment at 4H-SiC (0001) surface and its bond configuration
【24h】

Significant decrease of the interface state density by NH_3 plasma pretreatment at 4H-SiC (0001) surface and its bond configuration

机译:在4H-SiC(0001)表面通过NH_3等离子体预处理显着降低界面态密度及其键构型

获取原文

摘要

We have investigated NH_3 plasma pretreatment for Si- and C-face 4H-SiC and characterized interface properties and bond configuration. It is revealed that the NH_3 plasma pretreatment is effective to reduce interface state density on C-face. From X-ray photoelectron spectroscopy (XPS) measurements, N- and H-related C bonds were observed. N and H passivate C-related defects and dangling bonds, resulting in improved interface properties.
机译:我们研究了用于Si和C面4H-SiC的NH_3等离子体预处理,并表征了界面性质和键结构。结果表明,NH_3等离子体预处理可有效降低C面上的界面态密度。通过X射线光电子能谱(XPS)测量,观察到N和H相关的C键。 N和H钝化C相关的缺陷和悬空键,从而改善了界面性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号